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Using technologies such as Kryoflex® polycrystalline ceramic and explosively bonded metals, PA&E designs and manufactures hermetic electronic packaging for extreme environments. Whether it's
integrating hermetic components that protect satellites deep in space or producing hermetic connectors for oil-drilling tools that bore deep below the earth's surface, electronic packages from PA&E are designed to deliver high levels of reliability under the harshest conditions.
By pairing Kryoflex® and explosively bonded metal technologies;
utilizing precision machining techniques to build hermetic electronic packaging and using precision laser welding rather than solder joints, electronic packages from
PA&E won't be impacted by the two most common causes of hermetic package failure: solder joint fatigue and cracked glass.
PA&E produces titanium composite packaging and controlled expansion packaging for markets such as the military, aerospace industries and
also creates medical implantable packaging using biocompatible materials.
Laser Welding Eliminates Solder Joint Fatigue... Forever!
Download the Integrated Packaging Data Sheet (PDF 2.24 MB)
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