CONTROLLED EXPANSION PACKAGING

The new controlled expansion materials from Osprey offer unique combinations of thermal and mechanical properties, enabling housing designs with tailored expansion coefficients, good thermal transfer characteristics, and exceptionally low weight.

PA&E has developed optimized fabrication, plating, and welding technologies for these materials, enabling us to offer complete controlled expansion solutions.

Controlled Expansion Hermetic Packaging

PA&E fabricates turnkey packages in CE11, utilizing our well-established explosive bonding technology, for a completely welded hermetic assembly, incorporating both our laser-weldable DC Kryoflex^® connectors as well as our laser-weldable glass seal RF connectors. CE11 should be considered as an alternative for titanium and composite titanium-CuMo packages.

We also fabricate turnkey packages in CE7 using solder-in connector technology. These products target the market position usually held by Kovar^®, but provide an enormous weight advantage.

NEW We have combined the best of both worlds to produce a package with a low expansion CE7 floor and laser-weldable sidewalls, allowing, for the first time, an extremely lightweight package with a low expansion for substrate attach in a completely weldable design -- the ultimate for both reliability as well as rework ability.

Download the Controlled Expansion Packaging Insert (PDF 70.4 KB)

Kryoflex is a registered trademark of PA&E.
Kovar is a registered trademark of Carpenter Technologies.